Mold for footwear bottoms
US8641410B2 · kind B2 · utility
6Cited by
6References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 3, 2012 |
| Grant date | Feb 4, 2014 |
| Priority date | — |
| Expiry date | May 25, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29D35/142
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A mold devised for molding of footwear bottoms, composed of overlapping layers made with expandible reticulable polyolefin material, as well as for molding of other manufactures with monolithic structure composed of overlapping layers of expandible reticulable polyolefin materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.