Electrical connector and method of making it
US8641428B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 2, 2011 |
| Grant date | Feb 4, 2014 |
| Priority date | — |
| Expiry date | Dec 2, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49224
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention is an electrical connector in which a substrate (such as a printed circuit board or PCB) includes a plurality of apertures (or vias) and some of those apertures are filled with two materials to improve the characteristics of the electrical interconnection. The preferred process of crating the filled vias includes the steps of plating the vias with an electrically-conductive material to create an electrically-conductive path between portions of the substrate and components associated with the substrate and partially filling the apertures, then filling at least a portion of the apertures or vias with a second or different filling material to seal at least apart of the electrically conductive path through the plating. The second filling material may be chosen to provide thermal compensation for the connection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.