Polymer-based high surface area multi-layered three-dimensional structures and method of making same

US8641883B2 · kind B2 · utility

Assignee

• The Regents of the University of California · US

Inventors

• Lawrence Kulinsky · Los Angeles, US
• Marc J. Madou · San Diego, US

Key dates

• Filing date: Feb 17, 2011
• Grant date: Feb 4, 2014
• Expiry date: Jan 11, 2032

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C25D13/04
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A method of forming three-dimensional structures includes forming a conductive layer on a substrate and patterning a resist layer over the conductive layer, the resist layer having contained therein a plurality of vias. An electrically conductive polymer is then electro-deposited in the vias. The electro-deposition operation is then stopped to form one or more of posts, posts having bulbous termini (i.e., mushrooms), or a layer atop the resist layer. The resist may be removed to yield the structure which may be further processed. For example, the structure may be pyrolyzed. In addition, biomolecules may also be adhered or otherwise affixed to the structure.