Laser processing nozzle
US8642919B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 31, 2010 |
| Grant date | Feb 4, 2014 |
| Priority date | — |
| Expiry date | Feb 16, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/362
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser ablation nozzle including a main pressure chamber centered on an area of a substrate to be ablated and arranged to push a stream of gas through the main pressure chamber onto the substrate. A vacuum chamber surrounds the main pressure chamber and is arranged to vacuum away the process gas and ablation debris. To attempt to address uneven pressure and flow, flow restrictors can be provided at one or both of the process gas inlet and the vacuum chamber. The vacuum flow restrictor is intended to create constriction in a channel to generate a uniform vacuum induced flow around substantially the entire circumference of the nozzle opening. Similarly, the process gas flow restrictor is intended to generate substantially uniform gas flow into the main pressure chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.