Sensor device packaging
US8643127B2 · kind B2 · utility
9Cited by
59References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 21, 2008 |
| Grant date | Feb 4, 2014 |
| Priority date | — |
| Expiry date | Jul 22, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B7/0019
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A sensor device and a method of forming comprises a die pad receives a sensor device, such as a MEMS device. The MEMS device has a first coefficient of thermal expansion (CTE). The die pad is made of a material having a second CTE compliant with the first CTE. The die pad includes a base and a support structure with a CTE compliant with the first and second CTE. The die pad has a support structure that protrudes from a base. The support structure has a height and wall thickness which minimize forces felt by the die pad and MEMS device when the base undergoes thermal expansion or contraction forces from a header.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.