Integrated circuit package with discrete components surface mounted on exposed side
US8643192B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 16, 2012 |
| Grant date | Feb 4, 2014 |
| Priority date | — |
| Expiry date | May 27, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01029
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package has a host integrated circuit with an active front side that is surface-mounted on a support and an inactive back side. Conductive vias extend through the integrated circuit between the front and back sides. A redistribution layer on the back side of the host integrated circuit provides conductive traces and contact pads. The traces of the redistribution layer establish connection between the conductive vias and the contact pads. At least one additional component is surface-mounted on the back side of the host integrated circuit by electrical connection to the contact pads of the redistribution layer to provide a compact three-dimensional structure. In an alternative embodiment, the additional components can be mounted on the active side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.