Probing tip for a signal acquisition probe
US8643396B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 31, 2011 |
| Grant date | Feb 4, 2014 |
| Priority date | — |
| Expiry date | Aug 1, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48227
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A probing tip for a signal acquisition probe has a non-conductive substrate compatible with thin or thick film processing having opposing horizontal surfaces and side surfaces with two of the side surfaces converging to a point. A contoured probing tip contact is formed at the converging point on the non-conductive substrate with the probing tip contact having first and second intersecting arcuate surface. Electrically conductive material is deposited on the countered probing tip contact using thin or thick film processing for providing electrical contact to test points on a device under test. A resistive element is formed on the non-conductive substrate using thin film processing that is electrically coupled to the probing tip contact and to an input of an amplifier formed on an integrated circuit die mounted on the non-conductive substrate. The output of the amplifier is coupled to a transmission structure formed on a second non-conductive substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.