Integrated circuit film for smart card
US8644025B2 · kind B2 · utility
5Cited by
10References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2010 |
| Grant date | Feb 4, 2014 |
| Priority date | — |
| Expiry date | Oct 19, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/189
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An integrated circuit (IC) film for a smart card is provided. The IC film includes a flexible printed circuit (FPC) board, first electrical contacts, second electrical contacts, and an IC chip. The first electrical contacts are disposed on a first side of the FPC board, and the second electrical contacts are disposed on a second side of the FPC board. The IC chip is disposed on the FPC board and bonded to the leads of the FPC board to thereby form electrical connection. The total thickness of the FPC board and the chip is not larger than 0.5 mm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.