Alignment method for assembling substrates without fiducial mark
US8644591B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 17, 2012 |
| Grant date | Feb 4, 2014 |
| Priority date | — |
| Expiry date | Mar 8, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/166
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An alignment method for assembling substrates without fiducial mark is provided and has steps of: pre-defining at least two partially standard character regions; capturing at least two partially actual images of a first substrate; comparing to obtain at least two partially actual character regions; building an actual coordinate system of the first substrate; comparing the actual coordinate system with a coordinate system of a second substrate to obtain three types of offset values; moving the first substrate to a correct waiting position based on the offset values; ensuring if the first substrate is disposed at the correct waiting position; and stacking the first substrate with the second substrate to finish the alignment and installation. Thus, the alignment method of the present invention can be applied to to-be-installed substrates without any fiducial mark for alignment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.