Stress function calibration method
US8645086B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2010 |
| Grant date | Feb 4, 2014 |
| Priority date | — |
| Expiry date | Aug 22, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F30/23
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of predicting distortion in a workpiece may include measuring residual stress induced in a coupon surface of a plate coupon by a selected manufacturing operation. The induced residual stress measurements may be fitted to a curve shape function. A moment coefficient may be calculated based upon the fitted induced residual stress measurements. The moment coefficient may be used to calibrate a stress function and corresponding stress magnitude. The calibrated stress function may be applied to a model of the workpiece such that the distortion of the workpiece may be predicted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.