Method of preparing a composition in blister packages
US8646246B2 · kind B2 · utility
0Cited by
12References
11Claims
0Family size
Assignee
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Key dates
| Filing date | Jun 19, 2008 |
| Grant date | Feb 11, 2014 |
| Priority date | — |
| Expiry date | Oct 6, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1338
- WIPO fieldPharmaceuticals
- WIPO sectorChemistry
Abstract
The present invention provides methods for preparing compositions in blister packages using complex aluminum substrate materials, wherein said complex aluminum substrate materials comprise an intermediate aluminum layer, and first and second outer layers, wherein the material of the first outer layer differs from that of the second outer layer, and the flexural rigidity of the first outer layer differs from that of the second outer layer by 0-30%.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.