Contact stress sensor
US8646335B2 · kind B2 · utility
12Cited by
17References
54Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 12, 2012 |
| Grant date | Feb 11, 2014 |
| Priority date | — |
| Expiry date | Jan 25, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L1/18
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for producing a contact stress sensor that includes one or more MEMS fabricated sensor elements, where each sensor element of includes a thin non-recessed portion, a recessed portion and a pressure sensitive element adjacent to the recessed portion. An electric circuit is connected to the pressure sensitive element. The circuit includes a pressure signal circuit element configured to provide a signal upon movement of the pressure sensitive element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.