Polishing pad, and method for manufacturing polishing pad
US8647179B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 1, 2008 |
| Grant date | Feb 11, 2014 |
| Priority date | — |
| Expiry date | Apr 25, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D18/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
It is an object of the present invention to provide a polishing pad that is resistant to scratching and also has excellent flattening performance. One aspect of the present invention is a polishing pad, comprising a fiber-entangled body formed from fiber bundles made up of ultrafine fibers in which the average cross sectional area is between 0.01 and 30 μm2, and a macromolecular elastomer, wherein part of the macromolecular elastomer is present inside the fiber bundles, whereby the ultrafine fibers are bundled, the number of fiber bundles per unit of surface area present in a cross section in the thickness direction is at least 600 bundles per square millimeter, and the volumetric ratio of a portion excluding voids is between 55 and 95%.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.