Patent · US Active

Method of making large surface area filaments for the production of polysilicon in a CVD reactor

US8647432B2 · kind B2 · utility

1Cited by
33References
17Claims
0Family size

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Key dates

Filing dateJul 20, 2011
Grant dateFeb 11, 2014
Priority date
Expiry dateJul 20, 2031

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T117/104
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

A method for making a large surface area silicon filament for production of bulk polysilicon by chemical vapor deposition (CVD) includes melting silicon and growing the filament from the melted silicon by an EFG method using a shaping die. The cross sectional shape of the silicon filament is constant over its axial length to within a tolerance of 10%. In embodiments, a plurality of identical and/or dissimilar filaments are grown simultaneously using a plurality of shaping dies. The filaments can be tubular. Filament cross sections can be annular and/or can include outwardly extending fins, with wall and/or fin thicknesses constant to within 10%. Filaments can be doped with at least one element from groups 3 and 5 of the Periodic Table. The filament can have a length equal to a length of a specified slim rod filament, and a total impedance not greater than the slim rod impedance.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.