Photosensitive resin composition, photosensitive dry film and method for forming pattern
US8647807B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 27, 2010 |
| Grant date | Feb 11, 2014 |
| Priority date | — |
| Expiry date | Dec 27, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/184
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photosensitive resin composition comprising: a vinyl-based polymer (I) obtained by polymerizing a monomer mixture containing a monomer (a) having a phenolic hydroxyl group; a vinyl-based polymer (II) obtained by polymerizing a monomer mixture containing a carboxyl group-containing vinyl monomer (b), and having a weight average molecular weight of 20,000 to 100,000, provided that the vinyl-based polymer (I) is excluded; a quinonediazide compound (III); and a compound (IV) represented by following formula (5).[In the formula, Y is a hydrocarbon group of 1 to 6 carbon atoms; l and m are each independently an integer of 1 to 3; n is 1 or 2; p and q are each independently 0 or 1.].
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.