Semiconductor power modules and devices
US8648643B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 24, 2012 |
| Grant date | Feb 11, 2014 |
| Priority date | — |
| Expiry date | Jun 21, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10545
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic component is described which includes a first transistor encased in a first package, the first transistor being mounted over a first conductive portion of the first package, and a second transistor encased in a second package, the second transistor being mounted over a second conductive portion of the second package. The component further includes a substrate comprising an insulating layer between a first metal layer and a second metal layer. The first package is on one side of the substrate with the first conductive portion being electrically connected to the first metal layer, and the second package is on another side of the substrate with the second conductive portion being electrically connected to the second metal layer. The first package is opposite the second package, with at least 50% of a first area of the first conductive portion being opposite a second area of the second conductive portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.