Touch sensor system and method
US8648832B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2009 |
| Grant date | Feb 11, 2014 |
| Priority date | — |
| Expiry date | Jun 25, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49117
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A touch sensor assembly may include a cover, an electrode film assembly, an adhesive layer, a printed circuit board (PCB) electrically connected to the electrode film and a back plate configured to be coupled to the cover with the PCB and the electrode film assembly disposed between the housing and the back plate. The electrode film assembly may include an electrode film formed from a conductive ink and may comprise a plurality of contacts corresponding to a plurality of touch areas. The electrode film assembly may optionally comprise capacitive circuitry configured to exhibit a capacitance response to contact with the touch areas. The adhesive layer may be configured to secure the electrode film assembly to the cover. The PCB may be substantially planar and the cover may include an inner surface having a curvature. The electrode film may be configured to substantially conform to the curvature when secured thereto.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.