Method to eliminate reactive ion etching (RIE) loading effects for damascene perpendicular magnetic recording (PMR) fabrication
US8649123B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 26, 2008 |
| Grant date | Feb 11, 2014 |
| Priority date | — |
| Expiry date | Oct 30, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/3163
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for providing a perpendicular magnetic recording (PMR) head is disclosed. The method comprises: providing an insulating layer; covering the insulating layer with a hard mask material; forming a pre-defined shape in the hard mask material; forming a pole trench and a yoke area in the insulating layer by a first reactive ion etching (RIE) process in which the yoke area includes a loading prevention pattern; performing a wet etching process to remove the hard mask material from the pole trench and the yoke area; performing a second RIE process to remove the loading prevention pattern of the yoke area, wherein the pole trench and the remainder of the yoke area are not removed and remain having similar side wall angles; and providing a PMR pole in which at least a portion of the PMR pole resides in the pole trench.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.