Heat transfer arrangement and electronic housing comprising a heat transfer arrangement and method of controlling heat transfer
US8650891B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 16, 2009 |
| Grant date | Feb 18, 2014 |
| Priority date | — |
| Expiry date | Feb 7, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20381
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat transfer arrangement (100) comprises a refrigerant circuit (102), which refrigerant circuit (102) comprises an evaporator (104) adapted to be arranged inside an electronic component housing (112), a condenser (108) adapted to be arranged outside the electronic component housing (112), a first conduit (106) and a second conduit (110). A refrigerant is present in the refrigerant circuit (102) and in use is arranged to self-circulate by evaporating in the evaporator (104), rising as a gas through the first conduit (106), condensing in the condenser (108) and flowing through the second conduit (110) to the evaporator (104). The heat transfer arrangement (100) further comprises a reservoir (124) for liquid refrigerant connected to the refrigerant circuit (102). A control device associated with the reservoir (124) is operable such that liquid refrigerant is collected in the reservoir (124) from the refrigerant circuit (102) to reduce heat exchange from the inside of the electronic component housing (112) to the ambient environment and such that liquid refrigerant is introduced from the reservoir (124) to the refrigerant circuit to increase heat exchange from the inside of the elec…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.