Metal-free supported polycrystalline diamond and method to form
US8651204B2 · kind B2 · utility
7Cited by
10References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 26, 2010 |
| Grant date | Feb 18, 2014 |
| Priority date | — |
| Expiry date | May 27, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC22C2204/00
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
An cutting element incorporates a non-magnetic and electrically conductive substrate on which a layer of polycrystalline diamond particles is sintered to the substrate. An method of forming a cutting element comprises sintering the substrate, a layer of diamond particles and a catalyst source at a pressure greater than 20 kbar and a temperature greater than 1200° C. to form a layer of polycrystalline diamond particles bonded to the substrate. Cutting elements incorporating non-magnetic and electrically conductive substrates can be sectioned using ablation techniques, such as laser cutting.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.