Flux composition and soldering paste composition
US8652269B2 · kind B2 · utility
0Cited by
0References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2009 |
| Grant date | Feb 18, 2014 |
| Priority date | — |
| Expiry date | Feb 25, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3489
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Disclosed herein are a flux and a soldering paste based on the flux. The flux is free from a change in viscosity with age, “skinned surface,” and “rough and crumbling,” and is excellent in printability and solderability. The flux contains, as elements, a resin, a thixo agent, an activator, a solvent and glucopyranosylamine type nanotube. The soldering paste further contains a solder powder. Preferably, the solder powder is free from lead.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.