Method of forming a patterned substrate
US8652345B2 · kind B2 · utility
2Cited by
30References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 26, 2009 |
| Grant date | Feb 18, 2014 |
| Priority date | — |
| Expiry date | Jul 2, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0776
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of forming a patterned substrate is provided. The method includes providing a substrate (300) having a structured surface region comprising one or more recessed features (310). The method includes disposing a first liquid (325) onto at least a portion of the structured surface region. The method includes contacting the first liquid with a second liquid (330). The method includes displacing the first liquid with the second liquid from at least a portion (315) of the structured surface region. The first liquid is selectively located in at least a portion of the one or more recessed features.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.