Patent · US Active

Chia seed composition

US8652544B2 · kind B2 · utility

15Cited by
3References
12Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 6, 2009
Grant dateFeb 18, 2014
Priority date
Expiry dateMar 22, 2029

Classification

  • Technology area (CPC A)Human Necessities
  • CPC primaryA61K36/537
  • WIPO fieldPharmaceuticals
  • WIPO sectorChemistry

Abstract

A composition of matter is disclosed and formed from a stable, defatted whole grain flour derived from Salvia hispanica L. whole ground seed using a suitable solvent that is free of cyanogenic glycosides, vitamin antagonists, and gluten. The composition includes minerals, about 30% wt/wt protein, about 30-40% insoluble fiber and about 2-3% of fructo-oligosaccarides.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.