Packaging materials with enhanced thermal-insulating performance
US8652598B2 · kind B2 · utility
7Cited by
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20Claims
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Key dates
| Filing date | Aug 2, 2013 |
| Grant date | Feb 18, 2014 |
| Priority date | — |
| Expiry date | Aug 2, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31996
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A thermo-insulating packaging material including a paper-based substrate layer, a paper-based top layer and a thermal-insulating composition positioned between the paper-based substrate layer and the paper-based top layer, the thermal-insulating composition including a filler, an organic binder and a plasticizer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.