Making a microfluidic device with improved adhesion
US8652765B2 · kind B2 · utility
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24Claims
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Key dates
| Filing date | Jun 28, 2011 |
| Grant date | Feb 18, 2014 |
| Priority date | — |
| Expiry date | Mar 20, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2201/058
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method for making a microfluidic device, the method includes providing at least one inorganic layer on a substrate; applying an alkoxysilane material containing a primary or secondary amine on the at least one inorganic layer; baking the applied alkoxysilane material at a temperature greater than 130 degrees C.; applying an epoxy material to form an epoxy layer, wherein the applied alkoxysilane material is disposed at an interface between the epoxy layer and the at least one inorganic layer; and patterning the epoxy layer to provide a wall for defining a location for a fluid in the microfluidic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.