Stress-engineered interconnect packages with activator-assisted molds
US8652878B2 · kind B2 · utility
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2References
7Claims
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Key dates
| Filing date | Mar 13, 2013 |
| Grant date | Feb 18, 2014 |
| Priority date | — |
| Expiry date | Mar 13, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method includes providing a pad chip having contact pads, providing a spring chip having micro-springs, applying a chemical activator to one of either the pad chip or the spring chip, applying an adhesive responsive to the chemical activator on the other of the pad chip or the spring chip, aligning the pad chip to the spring chip such that the micro-springs will contact the contact pads, and pressing the pad chip and the spring chip together such that the chemical activator at least partially cures the adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.