Pinning and affixing nano-active material
US8652992B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 7, 2010 |
| Grant date | Feb 18, 2014 |
| Priority date | — |
| Expiry date | Feb 16, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C4/134
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A nanoparticle comprises a nano-active material and a nano-support. In some embodiments, the nano-active material is platinum and the nano-support is alumina. Pinning and affixing the nano-active material to the nano-support is achieved by using a high temperature condensation technology. In some embodiments, the high temperature condensation technology is plasma. Typically, a quantity of platinum and a quantity of alumina are loaded into a plasma gun. When the nano-active material bonds with the nano-support, an interface between the nano-active material and the nano-support forms. The interface is a platinum alumina metallic compound, which dramatically changes an ability for the nano-active material to move around on the surface of the nano-support, providing a better bond than that of a wet catalyst. Alternatively, a quantity of carbon is also loaded into the plasma gun. When the nano-active material bonds with the nano-support, the interface formed comprises a platinum copper intermetallic compound, which provides an even stronger bond.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.