Lightweight wall repair compounds
US8653158B2 · kind B2 · utility
7Cited by
15References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 10, 2013 |
| Grant date | Feb 18, 2014 |
| Priority date | — |
| Expiry date | Jul 10, 2033 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2003/265
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Herein are disclosed wall repair compounds comprising at least one or more polymeric binder latex emulsions, one or more inorganic fillers, and comprising an amount of organic polymeric thickener that is less than about 0.1 percent by weight based on the total weight of the wall repair compound. In certain embodiments, the wall repair compound comprises an inorganic filler system selected such that such that synthetic inorganic fillers comprise essentially 100 percent of the inorganic filler used. In certain embodiments, the wall repair compound comprises one or more glycol ether smoothing agents.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.