Solar cell lead, method of manufacturing the same, and solar cell using the same
US8653380B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Feb 26, 2010 |
| Grant date | Feb 18, 2014 |
| Priority date | — |
| Expiry date | May 18, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
Abstract
A solar cell lead includes a strip plate conductive material that a surface thereof is coated with solder plating. The coated solder plating includes a concavo-convex portion on a surface thereof and a 0.2% proof stress of not more than 90 MPa by a tensile test. The coated solder plating includes a hot-dip solder plating layer formed by supplying a molten solder on the surface of the strip plate conductive material. A plating temperature is set to be not higher than a liquidus-line temperature of the used solder plus 120° C., and an oxide film on a surface of the hot-dip solder plating layer is set to be not more than 7 nm in thickness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.