Method of forming substrate for fluid ejection device
US8653410B2 · kind B2 · utility
1Cited by
86References
35Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 28, 2005 |
| Grant date | Feb 18, 2014 |
| Priority date | — |
| Expiry date | Aug 15, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1634
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method of forming an opening through a substrate having a first side and a second side opposite the first side includes laser machining a first portion of the opening into the substrate from the second side toward the first side, and abrasive machining a second portion of the opening into the substrate. Abrasive machining the second portion of the opening into the substrate includes completing the opening through the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.