Semiconductor package apparatus
US8653640B2 · kind B2 · utility
6Cited by
9References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 5, 2012 |
| Grant date | Feb 18, 2014 |
| Priority date | — |
| Expiry date | Apr 5, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package apparatus includes a first semiconductor package including a first semiconductor chip, a first substrate, a first terminal, and a first signal transfer medium, and a second semiconductor package including a second semiconductor chip, a second substrate, a second terminal, and a second signal transfer medium. At least one package connecting solder ball is located between the first terminal and the second terminal. A first solder ball guide member is positioned around the first terminal of the first substrate and includes a first guide surface for guiding a shape of the package connecting solder ball.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.