Semiconductor device, power semiconductor module and power conversion device equipped with power semiconductor module
US8653652B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 24, 2010 |
| Grant date | Feb 18, 2014 |
| Priority date | — |
| Expiry date | Oct 17, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes: a case with an opening formed thereat; a semiconductor element housed inside the case; a first conductor plate housed inside the case and positioned at one surface side of the semiconductor element; a second conductor plate housed inside the case and positioned at another surface side of the semiconductor element; a positive bus bar electrically connected to the first conductor plate, through which DC power is supplied; a negative bus bar electrically connected to the second conductor plate, through which DC power is supplied; a first resin member that closes off the opening at the case; and a second resin member that seals the semiconductor element, the first conductor plate and the second conductor plate and is constituted of a material other than a material constituting the first resin member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.