Apparatus for providing haptic feedback
US8653721B2 · kind B2 · utility
1Cited by
1References
14Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Dec 14, 2011 |
| Grant date | Feb 18, 2014 |
| Priority date | — |
| Expiry date | Apr 25, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG10K11/004
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
Disclosed is an apparatus used in an electronic device for providing haptic feedback. The apparatus includes a main board defining a mounting surface, a vibration unit mounted on the mounting surface of the main board, the vibration unit being capable of vibrating along a direction parallel to the mounting surface and defining at least two fastening portions at two distal ends thereof. At least two screws are provided to fix the vibration unit on the main board through the fastening portions along a direction perpendicular to the mounting surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.