Ruggedized computer capable of operating in high temperature environments
US8654523B2 · kind B2 · utility
3Cited by
6References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 24, 2011 |
| Grant date | Feb 18, 2014 |
| Priority date | — |
| Expiry date | Jan 5, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/20
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Illustrative embodiments of the present invention are directed to a computer that has a housing with walls that form a substantially sealed interior cavity from an exterior environment. The computer includes a plurality of computer components within the interior cavity. The computer also includes at least one heat sink for dissipating thermal energy into the exterior environment. A cooling element is thermally coupled to the heat sink and at least one of the computer components to transfer thermal energy from the computer component into the heat sink and the exterior environment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.