Capacitor-incorporated substrate and component-incorporated wiring substrate
US8654539B2 · kind B2 · utility
4Cited by
2References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 4, 2010 |
| Grant date | Feb 18, 2014 |
| Priority date | — |
| Expiry date | Nov 21, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10674
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An object of the present invention is to provide a capacitor-incorporated wiring substrate in which connection reliability can be improved through ensuring of a path for supply of electric potential even upon occurrence of a faulty connection in a via-conductor group. In a capacitor-incorporated wiring substrate of the present invention, a capacitor 50 is accommodated in a core 11, and a first and a second buildup layers 12 and 13 are formed on the upper and lower sides, respectively, of the capacitor 50.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.