Method for manufacturing heat dissipating apparatus
US8656590B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 25, 2011 |
| Grant date | Feb 25, 2014 |
| Priority date | — |
| Expiry date | Aug 5, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49913
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An exemplary method for manufacturing a heat dissipation apparatus includes, firstly, providing a fin assembly including a stack of fins spaced from each other. Each fin defines a through hole therein, and includes a collar formed at an edge of the through hole. Then a heat pipe is provided, and inserted in the through holes of the fins. Next, two opposing punching tools are provided. Each punching tool defines a series of recesses. The subassembly of the heat pipe and fins is positioned between the two punching tools, with the collar of each fin located between two corresponding recesses of the two punching tools. The two punching tools punch the collars of the fins from two opposite sides of the collars. Thereby, the collars shrink inwardly and press the heat pipe to deform until the heat pipe is fittedly mounted in the collars of the fins.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.