Mezzanine connector
US8657627B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 2, 2012 |
| Grant date | Feb 25, 2014 |
| Priority date | — |
| Expiry date | Feb 2, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49218
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A two-piece mezzanine connector for high speed, high density signals. The connector is assembled from wafers that may be formed of identical wafer halves. The halves may have interior portions that form a channel in which a lossy member may be captured for selectively configuring the connector for high frequency performance. The lossy member may be serpentine, to both provide different spacing relative to signal and ground conductors and to provide compliance to press against ground conductors when captured between wafer halves. Instead of, or in addition to, the lossy member captured between two wafer halves, the wafer halves may each have lossy material overmolded on at least one side, so that an assembled wafer may have lossy material disposed on the outside. The wafers may have dovetail projections that are secured within dovetail channels, forming structural members of the connector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.