Implant delivery apparatus and methods with electrolytic release
US8657870B2 · kind B2 · utility
27Cited by
330References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2009 |
| Grant date | Feb 25, 2014 |
| Priority date | — |
| Expiry date | Oct 4, 2031 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61F2250/0071
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
Implant release apparatus includes a connector connecting a lead having an electrolytically erodible portion and a restraint that restrains the implant. In one embodiment, the connector can include or comprise a nonconductive member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.