Method and apparatus for layer bonding of display assembly
US8657992B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2009 |
| Grant date | Feb 25, 2014 |
| Priority date | — |
| Expiry date | Apr 7, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F2202/28
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method and apparatus for the bonding of one or more material layers to a display panel which yields a resulting bonded assembly which is transparent and substantially free of optical defects such as entrapped dirt and air bubbles. During the bonding process of the present disclosure, a moving dispensing probe, or needle, dispenses a liquid bonding material into an air gap between the surfaces to be bonded in a manner which continuously touches (wets) each surface simultaneously. By simultaneously wetting each surface, and by dispensing the liquid bonding material in a predetermined pattern between the surfaces, the introduction of entrapped dirt and the formation of air bubbles is prevented as the two mating surfaces are subsequently pressed together and the adhesive is cured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.