Method for producing an electronic component and electronic component

US8658442B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Christian Schmid · San Diego, US
• Tilman Schlenker · Nittendorf, DE
• Heribert Zull · Regensburg, DE
• Ralph Paetzold · Roth, DE
• Markus Klein · Glückstadt, DE
• Karsten Heuser · Erlangen, DE

Key dates

• Filing date: Jan 29, 2009
• Grant date: Feb 25, 2014
• Expiry date: Jul 3, 2030

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P70/50
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method for producing an electronic component comprising barrier layers for the encapsulation of the component comprises, in particular, the following steps: providing a substrate (1) with at least one functional layer (22), applying at least one first barrier layer (3) on the functional layer (22) by means of plasma-enhanced atomic layer deposition (PEALD), and applying at least one second barrier layer (4) on the functional layer (22) by means of plasma-enhanced chemical vapor deposition (PECVD).