Epoxy resin composition
US8658723B2 · kind B2 · utility
0Cited by
6References
44Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 17, 2003 |
| Grant date | Feb 25, 2014 |
| Priority date | — |
| Expiry date | Aug 25, 2025 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L77/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A composition capable of phase separation contains an epoxy resin and an impact modifier formed from at least one dimer fatty acid and/or dimer fatty diol. The composition is suitable for use as an adhesive, particularly in microelectronics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.