Light emitting device and manufacturing method thereof
US8659047B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 10, 2011 |
| Grant date | Feb 25, 2014 |
| Priority date | — |
| Expiry date | Oct 2, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8506
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light emitting device includes a substrate having an element mounting area in a principal surface thereof. The light emitting device also includes at least one light emitting element mounted in the element mounting area of the substrate. The light emitting device also includes a heat transfer member provided on the substrate. The heat transfer member has a thermal conductivity different from thermal conductivity of the substrate so as to form uneven thermal resistance distribution in the element mounting area. Thermal resistance in a heat radiation path through the substrate for release of heat emitted from the light emitting element changes with the mounting position of the light emitting element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.