Chipset package structure
US8659125B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Oct 9, 2008 |
| Grant date | Feb 25, 2014 |
| Priority date | — |
| Expiry date | Mar 21, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A chipset package structure includes a carrier, a plurality of pinouts, at least one semiconductor package preforms, at least one electromagnetic shielding layer and a protective layer. The pinouts are disposed on the carrier. The semiconductor package preforms is disposed on the second surface of the carrier and electrically connected to the pinouts. The electromagnetic shielding layer is disposed on the semiconductor package preforms and the electromagnetic shielding layer. At least one of the electromagnetic shielding layers comprises a carbon nanotube film structure. The protective layer covers the electromagnetic shielding layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.