Adhesive composition for producing semiconductor device and adhesive sheet for producing semiconductor device
US8659157B2 · kind B2 · utility
1Cited by
1References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 22, 2012 |
| Grant date | Feb 25, 2014 |
| Priority date | — |
| Expiry date | Aug 9, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An object of the present invention is to provide an adhesive composition that can form an adhesive sheet for producing a semiconductor device capable of suppressing deterioration in ion scavengeability after the adhesive sheet goes through thermal history. It is an adhesive composition for producing a semiconductor device containing at least an organic complex-forming compound that forms a complex with cations, and the 5% weight loss temperature of the organic complex-forming compound measured by thermogravimetry is 180° C. or more.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.