Chip package with reinforced positive alignment features
US8659161B2 · kind B2 · utility
3Cited by
1References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 21, 2011 |
| Grant date | Feb 25, 2014 |
| Priority date | — |
| Expiry date | Nov 11, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24479
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A chip package includes a substrate having a positive feature, which is defined on a surface of the substrate and which protrudes above a region on the surface proximate to the positive feature. Furthermore, the chip package includes a mechanical reinforcement mechanism defined on the substrate proximate to the positive feature that increases a lateral shear strength of the positive feature relative to the substrate. In this way, the chip package may facilitate increased reliability of a multi-chip module (MCM) that includes the chip package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.