Ultrasound transducer and method for manufacturing an ultrasound transducer
US8659212B2 · kind B2 · utility
14Cited by
10References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 16, 2012 |
| Grant date | Feb 25, 2014 |
| Priority date | — |
| Expiry date | Mar 31, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49005
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
An ultrasound transducer includes an array of acoustic elements, an integrated circuit, and an interposer. The interposer includes conductive elements that electrically connect the array of acoustic elements to the integrated circuit. An electrically conductive adhesive is engaged with the conductive elements of the interposer to electrically connect the interposer to at least one of the integrated circuit or the array of acoustic elements. The electrically conductive adhesive is anisotropically conductive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.