Liquid-cooled memory system having one cooling pipe per pair of DIMMs
US8659897B2 · kind B2 · utility
36Cited by
23References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 27, 2012 |
| Grant date | Feb 25, 2014 |
| Priority date | — |
| Expiry date | Aug 11, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/201
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Each pair of memory modules in a memory system are cooled using a shared cooling pipe, such as a heat pipe or liquid flow pipe. An example embodiment includes one pair of memory module sockets on opposite sides of the respective cooling pipe. An inner heat spreader plate is thermally coupled to the cooling pipe and in thermal engagement with a first face of the memory module adjacent to the included cooling pipe. Heat is conducted from the second face of the memory module to the cooling pipe, such as from an outer plate in thermal engagement with an opposing second face of the memory modules and with the inner plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.