Circuit board including a heat radiating plate
US8659900B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2011 |
| Grant date | Feb 25, 2014 |
| Priority date | — |
| Expiry date | Mar 28, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A circuit board is provided with a plurality of arms and a heat radiation plate. The insulating substrate of the each of the arms includes: a passive element region to which a passive element is connected; an active element region to which an active element is connected; and a wiring region on which wiring lines of the element group are laid. In the each of the arms, the passive element region, the active element region and the wiring region align in a lengthwise direction of the insulating substrate, and the passive element region and the wiring region are arranged on both sides of the active element region which is located centrally.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.