Method and system for avoiding package induced failure in swept semiconductor source
US8660164B2 · kind B2 · utility
1Cited by
46References
15Claims
0Family size
Assignee
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Key dates
| Filing date | Mar 23, 2012 |
| Grant date | Feb 25, 2014 |
| Priority date | — |
| Expiry date | Mar 23, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/183
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Dry oxygen, dry air, or other gases such as ozone are hermetically sealed within the package of the external cavity laser or ASE swept source to avoid packaging-induced failure or PIF. PIF due to hydrocarbon breakdown at optical interfaces with high power densities is believed to occur at the SLED and/or SOA facets as well as the tunable Fabry-Perot reflector/filter elements and/or output fiber. Because the laser is an external cavity tunable laser and the configuration of the ASE swept sources, the power output can be low while the internal power at surfaces can be high leading to PIF at output powers much lower than the 50 mW.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.