Wafer level optics

US8662765B2 · kind B2 · utility

Assignee

• DigitalOptics Corporation · US

Inventors

• Pavel Reshidko · Nes Ziona, IL
• Kai Engelhardt · Buckenhof, DE
• Ephraim Goldenberg · Ashdod, IL
• Michael Dror · Tel Aviv-Yafo, IL

Key dates

• Filing date: Apr 18, 2011
• Grant date: Mar 4, 2014
• Expiry date: Feb 21, 2032

Classification

• Technology area (CPC G): Physics
• CPC primary: G02B13/0085
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

Providing for a wafer level optical system employing composite lenses is disclosed herein. Conventional focus lens assemblies require three or more lenses. By way of example, two composite lenses can be used to reduce the cost of a wafer-level camera. In some aspects, the composite lenses can be aspheric and can employ a broader variety of wafer materials than earlier designs that only operated in narrow ranges of refractive indices and Abbe numbers.